IPC 4563 PDF Download
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Resin Coated Copper Foil for Printed Boards Guideline
standard by Association Connecting Electronics Industries, 11/01/2007
Document Format: PDF
Description
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.
Product Details
- Published:
- 11/01/2007
- Number of Pages:
- 19
- File Size:
- 1 file , 270 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
