BS PD IEC TR 61189-5-506:2019 PDF Download
$151.00
Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
standard by BSI Group, 07/18/2019
Description
This Technical Report is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.
Cross References:
IEC 60068-2-20:2008
IEC 61189-5-501
All current amendments available at time of purchase are included with the purchase of this document.
Product Details
- Published:
- 07/18/2019
- ISBN(s):
- 9780539000689
- Number of Pages:
- 26
- File Size:
- 1 file , 5.1 MB
- Product Code(s):
- 30373834, 30373834, 30373834
- Note:
- This product is unavailable in Ukraine, Russia, Belarus