IPC 4412 PDF Download
$52.00Specification for Finished Fabric Woven from "E" Glass for Printed Boards
standard by Association Connecting Electronics Industries, 06/01/2002
Association Connecting Electronics Industries
IPC serves more than 2,300 member companies worldwide involved in designing, manufacturing, specifying and/or using printed circuit boards. Approximately 200 standards, guidelines and technical reports cover topics ranging from design and printed circuit board manufacturing to electronics assembly and testing.
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
standard by Association Connecting Electronics Industries, 06/01/2002
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
standard by Association Connecting Electronics Industries, 01/01/2006
Specification for Finished Fabric Woven from "E" Glass for Printed Boards – Amendment 2
Amendment by Association Connecting Electronics Industries, 05/01/2018
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2013
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2021
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, includes Amendment 1 and 2
standard by Association Connecting Electronics Industries, 10/01/2002
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2
standard by Association Connecting Electronics Industries, 12/01/2012
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2017
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
standard by Association Connecting Electronics Industries, 07/27/2021
Specification for Immersion Silver Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 06/01/2005
Specification for Immersion Silver Plating for Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2009
Specification for Immersion Tin Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 01/01/2007
Specification for Immersion Tin Plating for Printed Circuit Boards with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2012
Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2022
Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 01/01/2013
Metal Foil for Printed Wiring Applications, Includes Amendment 1
standard by Association Connecting Electronics Industries, 05/01/2000
Metal Foil for Printed Board Applications
standard by Association Connecting Electronics Industries, 05/01/2008
Metal Foil for Printed Board Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2016
Resin Coated Copper Foil for Printed Boards Guideline
standard by Association Connecting Electronics Industries, 11/01/2007
Requirements for Printed Electronics Functional Conductive Materials
standard by Association Connecting Electronics Industries, 11/01/2012