IPC 4103A-WAM1 PDF Download
$85.00Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2014
Association Connecting Electronics Industries
IPC serves more than 2,300 member companies worldwide involved in designing, manufacturing, specifying and/or using printed circuit boards. Approximately 200 standards, guidelines and technical reports cover topics ranging from design and printed circuit board manufacturing to electronics assembly and testing.
Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2014
Specification for Base Materials for High Speed/High Frequency Applications
standard by Association Connecting Electronics Industries, 11/01/2017
Specifications for High Density Interconnect (HDI) and Microvia Materials
standard by Association Connecting Electronics Industries, 05/01/1999
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
standard by Association Connecting Electronics Industries, 08/01/1998
Specification and Characterization Methods for Nonwoven "E" Glass Materials
standard by Association Connecting Electronics Industries, 09/01/1998
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 04/01/2010
Flexible Base Dielectrics for Use in Flexible Printed Boards
standard by Association Connecting Electronics Industries, 12/01/2016
Specification for Flexible Base Dielectrics for Use in Flexible Printed Boards
standard by Association Connecting Electronics Industries, 01/01/2022
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
standard by Association Connecting Electronics Industries, 05/01/2002
Cover and Bonding Material for Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 01/01/2013
Cover and Bonding Material for Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 03/01/2018
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/31/2012
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 10/01/2013
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2018
Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement
standard by Association Connecting Electronics Industries, 04/01/1999
Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, Amendment 1
Amendment by Association Connecting Electronics Industries, 03/01/2001
Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, with Amendment 1
standard by Association Connecting Electronics Industries, 03/01/2001
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
standard by Association Connecting Electronics Industries, 11/01/2003