IPC CHIPSCALE-99 PDF Download
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Chip Scale and BGA National Symposium Proceedings 1999
Conference Proceeding by Association Connecting Electronics Industries, 05/01/1999
Document Format: PDF
Description
Proceedings are from the symposium held May 6-7, 1999 in Santa Clara, CA. The success of high density component packages is dependent on a “meeting of the minds” of the semiconductor manufacturer, the packaging technologist, the printed board fabricator, the assembly engineer and others. This event presented new substrate technology, wafer level processes, PCB design strategies, assembly and reliability data. OEMs and manufacturers and suppliers to the CSP/BGA assembly industry attended this two day event.
Product Details
- Published:
- 05/01/1999
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
