IPC J-STD-027 PDF Download
$61.00
Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
standard by Association Connecting Electronics Industries, 02/01/2003
Document Format: PDF
Description
THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
Product Details
- Published:
- 02/01/2003
- Number of Pages:
- 20
- File Size:
- 1 file , 90 KB
- Product Code(s):
- J-027(D)1, J-027(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
