BS PD IEC TR 63378-1:2021 PDF Download
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Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
standard by BSI Group, 01/11/2022
Document Format: PDF
Description
This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.
All current amendments available at time of purchase are included with the purchase of this document.
Product Details
- Published:
- 01/11/2022
- ISBN(s):
- 9780539171525
- Number of Pages:
- 24
- File Size:
- 1 file , 2.4 MB
- Product Code(s):
- 30434821, 30434821, 30434821
- Note:
- This product is unavailable in Ukraine, Russia, Belarus